Near NetShape siC Deposition

Why machine components from a solid block of material?

TevTech’s Near Net Shape Deposition Systems provide a cost effective method of mass producing near net shape monolithic parts. Large cost savings are realized by an increased raw material to product conversion ratio, decreased post-deposition part fabrication, decreased CVD process time, and increased product yield.  Materials include:

• Silicon carbide (TevTech’s U.S. Patent No. 6,231,923)
• Pyrolytic Boron Nitride
• Silicon nitride

SYSTEM CAPABILITY

• Internal Tooling Modules allow for a large number of product sites, flexible product mix, and quick turn around time.
  
  
• Deposition uniformity within +/- 10% is routinely achieved on the substrates to reduce deposition time and part fabrication time.
  
  
• Physical separation of the individual substrate sites limits the propagation of cracks between the substrates to greatly increase ‘as deposited’ yield.
  
  
• System configuration allows for deposition of Near Net Shape parts as well as coatings.

• Vapor Delivery System and Gas Flow Measurement system.
• Horizontal or Vertical Vacuum Furnace, Pumping System, Manifolds, and Particulate Filters.
• Internal Tooling Modules, Hot Zone, and Heating Element.
• Power Supply and Power Distribution System.
• Effluent Scrubbing System and Neutralization Station.
• Cooling Water Flow Manifolds and Safety Interlocks.
• PLC Based Process Control System, Automation, Touch Screen Operator Interface, Instrumentation, Alarms and Interlocks for Safety, Gas Leak Detection, Process Deviation, and Equipment Protection.